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​​​Diamond Superabrasives Powder

  •  A full line of diamond and cubic boron nitride (cBN) powders and slurries to satisfy all your abrasive needs for grinding wheels and dicing blades.

 

  •  Available in a versatile range of sizes from submicron to coarse.

 

  •  Controlled process that provides exceptionally consistent, reliable, and repeatable abrasives, offering customers a uniform grain size and shape for excellent results in grinding and lapping of tools.

 

  •  Blended with the highest-quality of synthetic diamond crystals, offering an exceptional surface finish when polishing and lapping hard and tough abrasive materials.

 

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Abrasives Hyperion

Our Diamond Product Range

 

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Hyperion Guarantees

 

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Versatility

 

A comprehensive and multifaceted product range that can be used across a wide range of applications, offering solutions for specific grinding, lapping, and polishing needs.

 

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Consistency

 

Hyperion's superabrasives exhibit unrivaled hardness, abrasion resistance, low coefficient of friction, and uniform grain size, delivering consistent performance results on time, every time.

 

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Extended Tool lifespan

 

Hyperion's superabrasives improve the sharpness of the workpiece and maintain its effectiveness over longer periods than other materials, providing a more extended tool life span before needing to be replaced.

 

 

About our Micron Powder

 

 

Have you ever wondered how we assist electronics companies with producing sapphire, silicon and silicon carbide wafers?

Matt Smith, manager of our Micron business segment, explains what micron diamond and cubic boron nitride (CBN) materials are and how they are used to produce a diverse group of components and materials in the automotive, medical and electronics markets.

 

Success Stories: How Hyperion Diamond Can Overcome CMP Bottleneck

 

 

The booming semiconductor market demands constant innovation in material processing, especially for emerging materials like silicon carbide (SiC). A critical step near the end of the process where diamond is often not used is the chemical mechanical polishing (CMP) stage. This crucial step removes possible surface defects in the SiC wafer. However, it’s very time-sensitive and often serves as a bottleneck that impacts efficiency output. Discover how submicron Hyperion Diamond can help reduce the final CMP bottleneck and produce epi-ready wafers efficiently.

 

Your Hyperion salesperson can offer their expertise in selecting the Diamond Powder best suited to solve your needs. Contact us now!

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