Tungsten Carbide Supported Compax® PCD Wire Die Blanks

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Hyperion Materials & Technologies manufactures tungsten carbide supported Compax® PCD die blanks for the wire-drawing industry. The polycrystalline diamond (PCD) core is integrally bonded to a tungsten carbide support ring. Grades are available with diamond grain sizes ranging from 3 to 50 micron and with dimensional sizing from D-12 to D-36.

PRODUCT DESCRIPTION

  • All blanks contain metal catalyst in PCD structure
  • Do not exceed 700°C in die mounting operations
  • Electrically conductive: diamond core may be pierced using EDM, laser, ultrasonic, or needle methods
  • Profiling of die geometry is normally performed using shaped needles with electrical discharge machining (EDM) or ultrasonic machines with diamond abrasives.

 

POLISHING

  • Diamond micron powder grade SJK-5 or GMM coating series recommended for final die bore shaping and polishing
  • For superior polish, use 0.25 μm or 0.5 μm graded diamond fines.

RECOMMENDED APPLICATIONS

25 μm and 50 μm Grain Sizes

  • Intermediate and rod break down drawing of copper, aluminum, and other non-ferrous materials.

5 μm and 25 μm Grain Sizes

  • Non-ferrous and ferrous intermediate and fine wires. Applications where superior surface quality is a must.

3 μm and 5 μm Grain Sizes

  • Non-ferrous and ferrous wire in finer sizes.
  • Critical surface finish applications.

 

Visit our Wire Dies page for additional information.

Your Hyperion sales person can offer their expertise in selecting the wire die product best suited to solve your needs.