UPM diamond powder improves semiconductor processing
After extensive R&D work, the experts at Hyperion Materials & Technologies pushed to develop a new solution for diamond powders in different sizes to better accomodate silicon carbide in processing semiconductors.
A new process was developed for removing all oversize particles from a diamond powder.
Grinding tests showed significant improvement with Hyperion's ultra premium micron diamond powder over incumbent materials.
Read more about the the improvements in tool life as well as the reduction in scratches by downloading the tech note.