Diamond Superabrasives Powder
- A full line of diamond and cubic boron nitride (cBN) powders and slurries to satisfy all your abrasive needs for grinding wheels and dicing blades.
- Available in a versatile range of sizes from submicron to coarse.
- Controlled process that provides exceptionally consistent, reliable, and repeatable abrasives, offering customers a uniform grain size and shape for excellent results in grinding and lapping of tools.
- Blended with the highest-quality of synthetic diamond crystals, offering an exceptional surface finish when polishing and lapping hard and tough abrasive materials.
Our Diamond Product Range
Hyperion Guarantees
Versatility
A comprehensive and multifaceted product range that can be used across a wide range of applications, offering solutions for specific grinding, lapping, and polishing needs.
Consistency
Hyperion's superabrasives exhibit unrivaled hardness, abrasion resistance, low coefficient of friction, and uniform grain size, delivering consistent performance results on time, every time.
Extended Tool lifespan
Hyperion's superabrasives improve the sharpness of the workpiece and maintain its effectiveness over longer periods than other materials, providing a more extended tool life span before needing to be replaced.
About our Grinding Solutions
Have you ever wondered how abrasive materials are used to produce tooling solutions for a broad industry base, including automotive, aerospace, medical, stone, mining, construction, semiconductor and electronics companies?
Iqbal Shaik, manager of our Grinding business segment, explains how our abrasives product line develops materials for toolmakers who produce removal solutions such as grinding wheels, saws, blades, honing stones, drill bits, and other tools used in a wide range of industries and applications.
Success Stories: How Hyperion Diamond Can Overcome CMP Bottleneck
The booming semiconductor market demands constant innovation in material processing, especially for emerging materials like silicon carbide (SiC). A critical step near the end of the process where diamond is often not used is the chemical mechanical polishing (CMP) stage. This crucial step removes possible surface defects in the SiC wafer. However, it’s very time-sensitive and often serves as a bottleneck that impacts efficiency output. Discover how submicron Hyperion Diamond can help reduce the final CMP bottleneck and produce epi-ready wafers efficiently.
Your Hyperion salesperson can offer their expertise in selecting the Diamond Powder best suited to solve your needs. Contact us now!
