Ultra Premium Micron Diamond Powder
Ultra premium micron diamond powder (UPM) is a modified, etched synthetic poly and shock diamond produced in micron sizes. UPM provides low and ultra-low conductivity designed to resolve quality issues in extremely precise tooling applications, such as silicon and silicon carbide (SiC) wafer processing, for chip making. The well-controlled particle size distributions provide the lowest oversized particles of any diamond powder available on the market, offering superior reproducibility.
Oversized particles can be extremely difficult to detect with traditional particle size detection techniques because they exist in such low amounts. It's essential to find oversized particles because they can cause chipping, scratching, and imperfections in the wafer, which can lead to a total loss of the wafer, resulting in the loss of hundreds of chips. Hyperion innovatively developed the UPM grade to help detect these oversized particles in ppb concentrations and efficiently remove them, ensuring a high-quality end product and significant cost savings.
Available in standard diamond size fractions and can be customized to meet specific surface cleanliness requirements, UPM powders contain added precision, providing semiconductor manufacturers with options to use thinner dicing blades to cut wafers. This results in less chipping and material loss, producing a higher yield of computer components from each wafer. Back-grinding wheels with UPM result in wafers with less scratch and superior surface finishes.
Product Groups
Hyperion Code: UPM
Description: Synthetic ultra premium micron diamond powder is designed for processes where a precise size range and consistency are key. Designed for exceptional performance when back-grinding, dicing, and other precision machining of silicon and semiconductor wafers.
Hyperion Code: UPM
Description: Synthetic ultra premium micron diamond powder is designed for processes where a precise size range and consistency are key. Designed for exceptional performance when back-grinding, dicing, and other precision machining of silicon and semiconductor wafers.
Ultra Premium Micron Benefits
Hyperions' UPM diamond powders exhibit several benefits for precision machining applications. They have the most tightly controlled size, shape, and surface properties in the industry. These ultra-premium products are derived from synthesized monocrystalline diamonds grown under conditions that create tough, uniform crystals that resist fracturing and have exceptional impact resistance. The ultra-precise particle size distribution produces superior reproducibility, minimizing chipping and material loss and providing higher production yields.
Ultra Premium Micron Applications
UPM is designed for precision machining applications due to its low levels of oversized particles, which is essential for achieving the required level of precision, surface finish, and dimensional accuracy. The uniformity and sharpness of the diamond parts allow for controlled material removal and minimal subsurface damage, resulting in high-quality precision machined parts for semiconductors, microelectronics, optics, photonics, medical devices, aerospace components, and mold and die making.
Frequently Asked Questions about Micron Diamond Powders
Ultra Premium Micron Diamond Powder (UPM) is a modified, etched synthetic poly and shock diamond produced in micron sizes. It provides low and ultra-low oversized particles, which provide exceptional quality and limit scratching, chipping, and imperfections on workpiece surfaces, such as silicon wafers.
Ultra Premium Micron Diamond Powder exhibits several benefits for precision machining applications. It contains the industry's most tightly controlled size, shape, and surface properties. These ultra-premium products are derived from synthesized monocrystalline diamonds grown under conditions that create tough, uniform crystals that resist fracturing and have exceptional impact resistance. The ultra-precise particle size distribution produces superior reproducibility, minimizing chipping and material loss and providing higher production yields.
Ultra Premium Micron Diamond powders are availalbe in standard diamond size fractions and can be customized to meet specific customer requirements for both size and surface cleanliness.
Ultra Premium Micron Diamond Powder is designed for precision machining applications due to its low levels of oversized particles, which is essential for achieving the required level of precision, surface finish, and dimensional accuracy. The uniformity and sharpness of the diamond parts allow for controlled material removal and minimal subsurface damage, resulting in high-quality precision machined parts for semiconductors, microelectronics, optics, photonics, medical devices, aerospace components, and mold and die making.
Ultra Premium Micron Diamond Powders are unique because they have the industry's lowest level of oversized particles. Oversized particles can cause chipping, scratching, and imperfections in wafers' surface quality. By containing limited oversized particles, UPM can help customers perfect their precise tooling and applications in the semiconductor and compound semiconductor markets.
