Quantis™ Polishing Slurry

Achieve Exceptional Slurry Savings

Quantis Polishing Slurry enables manufacturers to significantly reduce the time and costs associated with CMP. Quantis reduces the final use of CMP slurry by quickly and effectively removing wafer thickness while providing a very low surface roughness value during polishing immediately before CMP. With Quantis, wafer manufacturers improve processing efficiency by cutting CMP processing time in half while reducing the required amount of expensive CMP slurry. By using Quantis Polishing Slurries, wafer manufacturers have the potential to achieve up to 70% slurry savings when polishing epi-ready wafers.

Minimize Disposal Costs

Conventional CMP slurries are mostly considered hazardous due to the permanganate component in the formulation, meaning they must be neutralized before disposal. The stringent disposal processes lead to increased costs for waste handling systems, which usually extend production times.

Quantis Polishing Slurry, made of environmentally friendly suspensions with zero hazardous waste, offers an efficient and cost-effective polishing alternative to hazardous slurries. Wafer manufacturers can count on Quantis to simplify waste management processes and minimize unnecessary disposal costs.

Boost Wafer Yield

Achieve high-quality surface finishes with limited wafer scratching. Quantis polishes wafers faster with fewer reworks and errors than other diamond slurry options. Developed in the submicron size range and used on lapping or CMP machines, Quantis provides flexibility in wafer production, giving wafer manufacturers a consistent and reliable supply and eliminating concerns of slowdowns.

Ideally suited for applications requiring precision finishes, Quantis Polishing Slurry drastically reduces workpiece surface roughness because of its ultra-fine diamond crystals with a distinctive modified diamond surface.

One of the primary applications in which Quantis Polishing Slurries perform well is silicon carbide wafer manufacturing. SiC is extremely hard and brittle, so machining or polishing with improper materials can cause cracks, chips, scratches, and defects. Surface defects make SiC wafers unusable for precise semiconductor components. With its high material removal rates and excellent surface finishes, Quantis enables wafer manufacturers to produce epi-ready SiC wafers efficiently.

Quantis Polishing Slurry is an excellent drop-in solution for existing lapping and CMP machines, offering wafer manufacturers another solution for in-house machinery or an innovative option to expand operations.