Metal Bond Premium Grade Diamond Powder

Hyperion MBM diamonds

Hyperion Code: MBM

Grading: Mesh/FEPA

Description: Premium micron diamond powder designed for metal bond systems. Designed for exceptional performance when slicing and dicing during processing of silicon wafers, including lapping of glass and ceramics.

 

Hyperion Materials & Technologies manufactures metal bonded diamond micron powder in three grades (economy, standard, and premium), each of which is created for specific applications and conditions.

Our premium MBM diamond is used for slicing and dicing, processing of silicon wafers, and lapping of glass and ceramics, among other uses. Our diamond powder is crafted to resist impact and fracturing in the toughest conditions. Coatings are also available to enhance performance in the most intense conditions.

 

MBM Diamond

Hyperion Metal Bond Micron MBM Diamond Powder Hyperion's MBM® powder exhibits extremely tightly controlled size, shape, and surface properties. This premium product is derived from synthesized monocrystalline diamond. It is grown under conditions that create tough, uniform crystals that resist fracturing and have excellent impact resistance. MBM diamond powder is highly recommended for processing Si wafers, slicing and dicing applications, and lapping of glass and ceramics. Available with 56% or 30% Ni coating or Ti coating.

Your Hyperion sales person can offer their expertise in selecting the metal bond micron diamond powder best suited to solve your needs.

 

Hyperion also manufactures a range of resin bond micron diamond powders and mesh diamonds as well as mesh and micron cubic boron nitride (CBN).